The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2006
Filed:
Mar. 11, 2003
Yasuyuki Tanabe, Kanagawa, JP;
Katsuyuki Machida, Kanagawa, JP;
Hakaru Kyuragi, Tokyo, JP;
Tetsuya Oonishi, Osaka, JP;
Toshihiko Kumazaki, Tokyo, JP;
Yasuyuki Tanabe, Kanagawa, JP;
Katsuyuki Machida, Kanagawa, JP;
Hakaru Kyuragi, Tokyo, JP;
Tetsuya Oonishi, Osaka, JP;
Toshihiko Kumazaki, Tokyo, JP;
Nippon Telegraph and Telephone Corporation, Tokyo, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
NTT Electronics Corporation, Tokyo, JP;
Abstract
In a method of manufacturing a surface shape recognition sensor, first and second interconnections are formed on a semiconductor substrate. An interlayer dielectric film on the semiconductor substrate covers the interconnections. A first metal film is electrically connected to the interconnections through first and second through holes in the interlayer dielectric film. A first mask pattern on the first metal film covers predetermined first and second regions corresponding to the through holes, respectively. The exposed first metal film is selectively removed to form a sensor electrode and connection electrode film, formed of the first metal film, in the first and second regions, respectively. An insulating passivation film on the interlayer dielectric film covers the sensor electrode and connection electrode film. A third through hole in the passivation film reaches the connection electrode film. A second metal film on the passivation film is in contact with the exposed connection electrode film. A second mask pattern on the second metal film has a pattern portion on a predetermined region. The second metal film is selectively removed using the second mask pattern as a mask to form a ground electrode connected to the second interconnection through the connection electrode film.