The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2006

Filed:

Sep. 21, 2005
Applicants:

Nobuyuki Asakura, Shizuoka, JP;

Tadahisa Sakaguchi, Shizuoka, JP;

Inventors:

Nobuyuki Asakura, Shizuoka, JP;

Tadahisa Sakaguchi, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/648 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of grounding a shielded wire and a structure of grounding a shielded wire, a ring portion is formed in a ring shape by leading a braided wire to or to an opposite side of an insulating outer sheath so as to be separated in an outer circumferential direction of the insulating outer sheath. With respect to an outer circumference of the insulating outer sheath, an inner circumferential cylinder is disposed at an inner circumference side of the ring portion and an outer circumferential cylinder is disposed at an outer circumference side thereof. Further, the outer circumferential cylinder and the inner circumferential cylinder are connected each other to form a sleeve fitting. With the sleeve fitting, an attached wire is connected to the ring portion, such that grounding is performed.


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