The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2006

Filed:

Aug. 25, 2000
Applicant:

Wilfried Hofmann, Munich, DE;

Inventor:

Wilfried Hofmann, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The cooling device, particularly for electronic components, such as microprocessors, consists of a substrate (), which features a heat-inlet surface that is in thermal contact with an object () to be cooled and a heat-dissipation surface. The heat-dissipation surface has a defined structure, preferably in the form of continuous channels (), and has a significantly larger surface area than the heat-inlet surface. At least the heat-inlet surface, but preferably also all or significant portions of the heat-dissipation surface are provided with a thin coating () made of heat-conductive material. Another improvement is obtained because the surface features a coating made of fine particles (), e.g., made of metal or metal oxide, which further increases the surface area.


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