The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2006

Filed:

Nov. 28, 2003
Applicant:

Reinhold Schneeberger, Seukendorf, DE;

Inventor:

Reinhold Schneeberger, Seukendorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A mounting device (), an apparatus () and an assembly system for apparatuses () including those with a greater weight, whereby the individual parts can be interconnected using simple tools. The apparatuses () are hooked into a profile () of a mounting device () and are then secured onto a mounting rail () of the mounting device (). The mounting device () has two integrated cable channels () so that cables which are subject to interference, such as power supply cables, are accommodated separately from sensitive cables, such as data transmission cables, and can be protected from ambient influences. The mounting device () is provided with a front panel () as a cover. The design of the mounting device () with the front panel () as a closed unit offers a high level of EMC and ESD protection, in addition to good protection against ambient conditions and weather conditions, in particular moisture and dust. Electric connections of the individual apparatuses () to one another are established easily through the use of plugs () arranged on the sides of the apparatuses when the apparatuses () are configured to be placed side by side in the mounting device () in a precisely defined position. Modules in the interior of the apparatuses () may thus be interconnected directly without needing additional bus lines and/or bus modules.


Find Patent Forward Citations

Loading…