The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Jul. 20, 2004
Jae-young Hong, Chungcheongnam-do, KR;
Jae-young Hong, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package and a method of manufacturing the same: The package includes a substrate, an external connection terminal portion on at least one edge thereof; a semiconductor chip bonded to the substrate, the semiconductor chip including a plurality of bonding pads; and a flexible film, which electrically connects the semiconductor chip to the external connection terminal portion. The flexible film includes an insulating film; a plurality of first terminals extending through the insulating film, the first terminals contacting external connection terminals of the external connection terminal portion; a plurality of second terminals extending through the insulating film and spaced a predetermined distance apart from the first terminals, the second terminals contacting the bonding pads; and conductive line patterns formed on a top surface of the insulating film, the conductive line patterns electrically connecting the first terminals to the second terminals that respectively correspond to the first terminals.