The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Sep. 26, 2002
Kuno Wolf, Jungingen, DE;
Stephan Ernst, Odfildern, DE;
Robert Plikat, Ummern, DE;
Wolfgang Feiler, Reutlingen, DE;
Kuno Wolf, Jungingen, DE;
Stephan Ernst, Odfildern, DE;
Robert Plikat, Ummern, DE;
Wolfgang Feiler, Reutlingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method for packaging electronic assemblies and a multiple chip package, at least one power semiconductor chip being applied to a base plate using a first solder, at least one logic chip being applied to the base plate, the logic chip and the base plate being positioned electrically insulated from one another, at least one logic chip being connected to the at least one power semiconductor chip using signal transmission lines, and the electronic assembly including the at least one power semiconductor chip and the at least one logic chip being packaged using a molding compound in order to provide a multiple chip package.