The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Nov. 29, 2004
Christian Göbl, Nuremberg, DE;
Heinrich Heilbronner, Stein, DE;
Christian Göbl, Nuremberg, DE;
Heinrich Heilbronner, Stein, DE;
SEMIKRON Elektronik GmbH & Co., KG, Nümberg, DE;
Abstract
A power semiconductor module and a method for producing it, wherein the module includes a substrate, with conductor tracks disposed on it to suit circuitry with which the module is used and with power semiconductor components disposed on the conductor tracks. Also disposed on the conductor tracks are spacer elements and a foil composite that includes two metal foil layers with an electrically insulating foil layer disposed between them. The foil composite has contact humps and plated-through holes. At least one of the metal foil layers is structured in a manner to suit the circuitry with which the module is used, and this foil composite is durably connected to the power semiconductor components and to the spacer elements, preferably by ultrasonic welding.