The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Apr. 15, 2004
Applicant:
Keiichi Sato, Wako, JP;
Inventor:
Keiichi Sato, Wako, JP;
Assignee:
Honda Motor Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 4/00 (2006.01); G01N 21/25 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bond separation inspection method using an optical fiber sensor. The method includes a step of embedding a sensor part of an optical fiber sensor in an adhesive joining a plurality of members together. The sensor part is embedded in the adhesive in such a way that the sensor part undergoes a compressive strain. Separation of the bond is detected on the basis of an optical characteristic of the sensor part when light from a light source is directed into the optical fiber sensor.
Quick Actions:
Sato, Keiichi. (2006). Bond separation inspection method using compressive thermal strain in optical sensor part (U.S. Patent No. 7041960). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7041960
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