The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
May. 21, 2001
Thermoplastic molding compounds with improved surface properties and improved structural homogeneity
Alfred Eitel, Johann, AT;
Michael König, Shanghai, CN;
Dorothy Rose, Dormagen, DE;
Hans-bernhard Hauertmann, Dormagen, DE;
Heinrich Alberts, Odenthal, DE;
Dieter Wittmann, Leverkusen, DE;
Alfred Eitel, Johann, AT;
Michael König, Shanghai, CN;
Dorothy Rose, Dormagen, DE;
Hans-Bernhard Hauertmann, Dormagen, DE;
Heinrich Alberts, Odenthal, DE;
Dieter Wittmann, Leverkusen, DE;
Bayer Aktiengesellschaft, Leverkusen, DE;
Abstract
Homo- and/or copolymers of one or more ethylenically unsaturated monomers, suitable for the preparation of molded articles that feature improved properties, especially improved fracture properties, heat stability and notched impact strength are disclosed. These homo- and/or copolymers are characterized in that they contain less than 400 particles per mof surface area with a diameter greater than 200 μm.