The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2006

Filed:

Oct. 09, 2001
Applicants:

Elisabeth Clamer, Offenbach, DE;

Anne Kraus-klapper, Wiesbaden, DE;

Andreas Schulz, Offenbach, DE;

Elisabeth Zimmerbeutel, Rodenbach, DE;

Inventors:

Elisabeth Clamer, Offenbach, DE;

Anne Kraus-Klapper, Wiesbaden, DE;

Andreas Schulz, Offenbach, DE;

Elisabeth Zimmerbeutel, Rodenbach, DE;

Assignee:

Ferero GmbH, Frankfurt am Main, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a noble metal preparation for the production of noble metal decorations on firable decoration substrates by direct printing and indirect printing (decalcomania method). The print quality of the noble metal compounds and preparations containing a binder system on markedly curved glass may be improved when the decalcomania method is used in that the binder system consists of a resin mixture comprising (a) 25 to 50 wt. % of polyamide resins, (b) 5 to 30 wt. % of sulphurized recent resins, (c) 10 to less than 20 wt. % of colophony-modified resins, (d) 10 to 40 wt. % of alkyl phenolic resins and (e) 0 to 30 wt. % of other resins compatible therewith, wherein two or more components of said resin mixture may be present in the form of a reaction product formed at 50 to 150° C. and/or wherein one or more components of said resin system or reaction product thereof may be present in the form of a reaction product formed at 50 to 150° C. in the presence of a sulphur-containing gelation agent and the noble metal compounds.


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