The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2006

Filed:

Aug. 01, 2001
Applicants:

Mika Okumura, Tokyo, JP;

Makio Horikawa, Tokyo, JP;

Kiyoshi Ishibashi, Tokyo, JP;

Inventors:

Mika Okumura, Tokyo, JP;

Makio Horikawa, Tokyo, JP;

Kiyoshi Ishibashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A main object of the present invention is to provide a manufacturing method of a thin-film structural body removing a sacrifice film without removing other insulating films. In order to achieve the above-mentioned object, upon forming an anchor hole () which forms an opening on the surface of a wiring (), two etching steps are employed on a sacrifice film (). In the first etching step, the sacrifice film () is partially removed by a dry etching process with an anisotropy above a wiring () with the sacrifice film () being left. In the second etching step, the remaining sacrifice film () above the wiring () is removed by a wet etching process with an isotropic.


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