The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
May. 31, 2002
Tsutomu Nagaoka, Shinagawa-ku, JP;
Toshiaki Hotaka, Chiba, JP;
Tsutomu Nagaoka, Shinagawa-ku, JP;
Toshiaki Hotaka, Chiba, JP;
Kabushiki Kaisha Kobe Seiko Sho, Tokyo, JP;
Teijin Chemicals, Ltd., Tokyo, JP;
Abstract
In an injection compression-molding apparatus, a molded article is produced by setting moldsandto an intermediate clamped state, and then by setting the moldsandto a final clamped state by re-clamping the moldsandto each other after injecting melted resin into a cavity defined by the moldsand. The apparatus includes a clamping mechanism and a parallelism retaining mechanism. The clamping mechanism has a mold-driving cylinderfor moving the movable moldtoward and away from the fixed mold, a guide engaging member, support panels, etc. so as to selectively set the moldsandto the intermediate clamped state and the final clamped state. The parallelism retaining mechanismretains parallelism between the moldsandin the intermediate clamped state by giving a corrective force to mold attaching surfaces of the clamping mechanism where the respective moldsandare mounted.