The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Jan. 16, 2001
Junichi Koyama, Kanagawa, JP;
Hitoshi Omata, Kanagawa, JP;
Osamu Hayama, Kanagawa, JP;
Kazunari Imai, Kanagawa, JP;
Tokuro Takehara, Kanagawa, JP;
Tetsuya Anzai, Kanagawa, JP;
Junichi Koyama, Kanagawa, JP;
Hitoshi Omata, Kanagawa, JP;
Osamu Hayama, Kanagawa, JP;
Kazunari Imai, Kanagawa, JP;
Tokuro Takehara, Kanagawa, JP;
Tetsuya Anzai, Kanagawa, JP;
Amada Company, Limited, Kanagawa, JP;
Abstract
An actual plate thickness and actual material constants are measured during punching before bending. The measured information is reflected on the bending, so that the bending is performed efficiently and accurately. Punching is carried out for each blank developed based on a nominal plate thickness and nominal material constants in blanking before the bending of a work W. Then, an actual plate thickness distribution and an actual material constant distribution of the work W are calculated based on various data containing a ram stroke and a pressure detected in the punching.