The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2006
Filed:
Apr. 29, 2005
Abhijeet V. Chavan, Carmel, IN (US);
Jeffrey A. Mars, Kokomo, IN (US);
Ian D. Jay, Logansport, IN (US);
Johnna L. Wyant, Kokomo, IN (US);
David W. Ihms, Russiaville, IN (US);
John K. Isenberg, Rossville, IN (US);
Roger E. Worl, Russiaville, IN (US);
Abhijeet V. Chavan, Carmel, IN (US);
Jeffrey A. Mars, Kokomo, IN (US);
Ian D. Jay, Logansport, IN (US);
Johnna L. Wyant, Kokomo, IN (US);
David W. Ihms, Russiaville, IN (US);
John K. Isenberg, Rossville, IN (US);
Roger E. Worl, Russiaville, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A method of flip-chip mounting a circuit device to a substrate in a manner that avoids damage and impairment of a fragile or otherwise sensitive element on the device facing the substrate, and a circuit assembly produced thereby. The assembly includes a substrate having at least two sets of bonding sites spaced apart from each other to define an intermediate surface region therebetween. The device is attached to the bonding sites with solder connections, with the solder connections being present on a surface of the device that faces the substrate and on which the element is present so that the element overlies the intermediate surface region of the substrate. An underfill material is present between the device and the substrate and encapsulates the solder connections. The underfill material is separated from the intermediate surface region of the substrate so that the underfill material does not contact the element.