The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2006
Filed:
Aug. 20, 2003
Patrick H. Buffet, Essex Junction, VT (US);
Charles S. Chiu, Essex Junction, VT (US);
Jon D. Garlett, Poughquag, NY (US);
Louis L. Hsu, Fishkill, NY (US);
Brian J. Schuh, Apex, NC (US);
Patrick H. Buffet, Essex Junction, VT (US);
Charles S. Chiu, Essex Junction, VT (US);
Jon D. Garlett, Poughquag, NY (US);
Louis L. Hsu, Fishkill, NY (US);
Brian J. Schuh, Apex, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor chip package with reduced cross-talk between adjacent signals in a layer of a carrier is disclosed. A first pair of conductors for carrying a first signal is provided in a layer of the carrier. A second pair of conductors for carrying a second signal is provided adjacent to the first pair of conductors in the layer, where the first and second pairs of conductors are configured such that cross-talk between the first and second pairs of conductors is substantially minimized, without increasing the size of the package. The height of the first pair of conductors is shorter than the second pair of conductors. Alternatively, the first and second pairs of conductors are configured so that they evenly affect each other. The chip package thus reduces the cross-talk without compromising the density of the interconnections in the package or resulting in an increase in the size of the package.