The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2006
Filed:
Sep. 07, 2004
Michael Casey, London, GB;
Hong Hao, Saratoga, CA (US);
Michael Casey, London, GB;
Hong Hao, Saratoga, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
The invention provides a system and method for providing scalability in an integrated circuit (IC) having a package coupled to a die through package balls. The die includes a plurality of input/output (I/O) slots and a hardmac configured to implement a logic function. A patch board is included between the hardmac and the I/O slots, wherein the hardmac includes a plurality of attachment points. The hardmac is attached to the plurality of I/O slots through the patch board, wherein adjacent attachment points join to non-adjacent I/O slots through the patch board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile