The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2006

Filed:

Oct. 25, 2001
Applicants:

Olivier Miserque, Mont-Saint-Guibert, BE;

Jacques Michel, Seneffe, BE;

Marc Dupire, Mons, BE;

Fabian Siberdt, Brussels, BE;

Jean-louis Costa, Grimbergen, BE;

Serge Bettonville, Crisnée, BE;

Inventors:

Olivier Miserque, Mont-Saint-Guibert, BE;

Jacques Michel, Seneffe, BE;

Marc Dupire, Mons, BE;

Fabian Siberdt, Brussels, BE;

Jean-Louis Costa, Grimbergen, BE;

Serge Bettonville, Crisnée, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/04 (2006.01); C08F 10/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polyethylene resin comprising a blend of from 35 to 49 wt % of a first polyethylene fraction of high molecular weight and 51 to 65 wt % of a second polyethylene fraction of low molecular weight, the first polyethylene fraction comprising a linear low density polyethylene having a density of up to 0.928 g/cm, and an HLMI of less than 0.6 g/10 min and the second polyethylene fraction comprising a high density polyethylene having a density of at least 0.969 g/cm, and an MIof greater than 100 g/10 min, and the polyethylene resin, having a density of greater than 0.951 g/cmand an HLMI of from 1 to 100 g/10 min.


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