The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2006

Filed:

Oct. 15, 2002
Applicants:

Ju-ming Hung, Yardley, PA (US);

Yue S. Zhang, Somerset, NJ (US);

Wayne K. Chu, Basking Ridge, NJ (US);

Inventors:

Ju-Ming Hung, Yardley, PA (US);

Yue S. Zhang, Somerset, NJ (US);

Wayne K. Chu, Basking Ridge, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 101/00 (2006.01); C08F 8/00 (2006.01); C08F 283/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.


Find Patent Forward Citations

Hung, Ju-Ming. (2006). Reactive hot melt adhesive with non-polymeric aromatic difunctionals (U.S. Patent No. 7037402). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7037402

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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