The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7037184 B1

PDF
Full Text
Expired
Date of Patent:
May. 02, 2006

Filed:

Jan. 22, 2003
Applicants:

Angela Petroski, Crawfordsville, IN (US);

Richard D. Cooper, Sullivan, IN (US);

Paul Fathauer, Sullivan, IN (US);

Marc Andrew Yesnik, Crawfordsville, IN (US);

Inventors:

Angela Petroski, Crawfordsville, IN (US);

Richard D. Cooper, Sullivan, IN (US);

Paul Fathauer, Sullivan, IN (US);

Marc Andrew Yesnik, Crawfordsville, IN (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.


Find Patent Forward Citations

Petroski, Angela. (2006). Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same (U.S. Patent No. 7037184). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7037184

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…