The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7036221 B1

PDF
Full Text
Expired
Date of Patent:
May. 02, 2006

Filed:

Feb. 20, 2004
Applicants:

Takaaki Higashida, Kadoma, JP;

Koichi Kumagai, Ikoma, JP;

Takahiro Matsuo, Hirakata, JP;

Inventors:

Takaaki Higashida, Kadoma, JP;

Koichi Kumagai, Ikoma, JP;

Takahiro Matsuo, Hirakata, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K 3/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.


Find Patent Forward Citations

Higashida, Takaaki. (2006). Method of manufacturing a semiconductor element-mounting board (U.S. Patent No. 7036221). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7036221

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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