The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2006
Filed:
May. 28, 2002
Tatsuya Nagata, Tsuchiura, JP;
Seiji Miyamoto, Ome, JP;
Hideko Ando, Ome, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The invention eliminates a need to increase a size of a semiconductor device and reduces occurrence of noise. A semiconductor device of the invention includes: a base () having front layers () provided on respective sides of a core layer () formed by a printed circuit board, and a semiconductor chip () mounted on the base (), wherein the semiconductor chip () is joined to one () of the front layers by using a joining member (), and the other front layer () has a plurality of external terminals () arranged thereon, and the core layer () has a plurality of through-holes () formed therein to electrically connect the semiconductor chip () to the plurality of external terminals () together, and the plurality of through-holes () include a plurality of arrayed through-holes () arranged correspondingly to the arrangement of the plurality of external terminals () and one or more additional through-holes () formed between the plurality of arrayed through-holes ().