The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2006
Filed:
Oct. 15, 2002
Wen-chien Hsiao, San Jose, CA (US);
Peter Beverley Powell Phipps, Saratoga, CA (US);
Yong Shen, Saratoga, CA (US);
John Jaekoyun Yang, Pinole, CA (US);
Samuel Wei-san Yuan, Saratoga, CA (US);
Wen-Chien Hsiao, San Jose, CA (US);
Peter Beverley Powell Phipps, Saratoga, CA (US);
Yong Shen, Saratoga, CA (US);
John Jaekoyun Yang, Pinole, CA (US);
Samuel Wei-san Yuan, Saratoga, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A magnetic head having read and write elements is provided according to one embodiment. The head includes a substrate. An undercoating is coupled to the substrate. The undercoating has a preferred thickness of between about 1.5 and 0.5 microns or less in a direction perpendicular to the planar surface of the substrate engaging the undercoating. Preferably, the undercoating is reduced to a desired thickness during fabrication using chemical mechanical polishing. The undercoating is constructed of a material having a thermal conductivity greater than that of amorphous AlO. An electric contact pad is operatively coupled to a layer positioned between the pad and the undercoating. Electric contact pads of read and write elements are preferably separated from the undercoating by insulation planarization layers. A write element is coupled to the undercoating. The write element has an electrically conductive coil. The new thinner and more thermally conductive undercoating allows more heat to transfer through it from the write element to the substrate.