The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2006

Filed:

May. 28, 2003
Applicants:

Koji Yamamoto, Ishikawa-ken, JP;

Masashi Omura, Shiga-ken, JP;

Katsuhiro Ikada, Moriyama, JP;

Inventors:

Koji Yamamoto, Ishikawa-ken, JP;

Masashi Omura, Shiga-ken, JP;

Katsuhiro Ikada, Moriyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01);
U.S. Cl.
CPC ...
Abstract

A surface acoustic wave device includes a sealing resin for sealing a gap between a surface acoustic wave element and a mounting board. The sealing resin is prevented from flowing so as to reach a vibrating portion of the surface acoustic wave element. In the surface acoustic wave device, a surface acoustic wave element is connected to a mounting board through bumps, the outer peripheral edge of the surface acoustic wave element is sealed by a sealing resin, and a vibration space is secured between the vibrating portion of the surface acoustic wave element and mounting board. In the surface acoustic wave element, an outer barrier enclosing the bumps and the vibrating portion and an inner barrier enclosing the vibrating portion are provided, the height of the outer barrier is lower than the total height of the height of the bumps and the height of electrode lands formed on the mounting board, and the height of the inner barrier is lower than the height of the bumps.


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