The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2006
Filed:
Apr. 09, 2004
Applicant:
Thilo Stolze, Arnsberg, DE;
Inventor:
Thilo Stolze, Arnsberg, DE;
Assignee:
Eupec Europaische Gesellschaft fur Leistungshalbleiter GmbH, Warstein, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor power module () comprises at least a substrate () including at least a semiconductor element () and a pressing device () which acts on the substrate (). The pressing device () enables to press the substrate (), when mounted, on a cooling element () so as to evacuate from semiconductor components operational heat losses. The pressing device () consists of a housing () provided with at least an elastic deformation zone ().