The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2006
Filed:
Jul. 08, 2004
Akio Hirakawa, Tokyo, JP;
Yoshiaki Fujita, Tokyo, JP;
Tomokazu Komazaki, Saitama, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A filter chip lying on an upper surface of a top layer package substrate is connected to an upper surface ground electrode (). The upper ground electrode () and a lower surface ground electrode () are connected to each other via through electrodes (), ground wiring patterns (), first connecting lines (to), and second connecting lines (). The first connecting lines (to) are connected to the ground wiring patterns (), whereas the second connecting lines () are not connected to the ground wiring patterns (), respectively. Owing to the provision of the connecting lines connected to the ground wiring patterns () and the connecting lines unconnected to the ground wiring patterns (), the impedance between a multilayer package substrate and ground can be adjusted.