The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2006
Filed:
Aug. 09, 2002
Günther Schindler, München, DE;
Werner Pamler, München, DE;
Zvonimir Gabric, Zorneding, DE;
Infineon Technologies, AG, Munich, DE;
Abstract
An interconnect arrangement comprises a substrate made from a first insulating material with a substrate surface, at least two interconnects which are arranged next to one another in the substrate, a buffer layer made from a second insulating material above the substrate and comprising a buffer-layer surface, which is parallel to the substrate surface, at least one cavity, which is arranged between the interconnects and, with respect to the buffer-layer surface, extends deeper into the substrate than the interconnects, and a covering layer made from a third insulating material, which is arranged above the buffer layer and completely closes off the cavity with respect to the buffer-layer surface.