The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2006

Filed:

Jan. 26, 2005
Applicants:

Wai Wong Chow, Hong Kong, HK;

Zhi-gang Bai, Tian Jin, CN;

Clem H. Brown, Scottsdale, AZ (US);

Inventors:

Wai Wong Chow, Hong Kong, HK;

Zhi-Gang Bai, Tian Jin, CN;

Clem H. Brown, Scottsdale, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A leadframe () for a semiconductor device includes a first leadframe portion () having a perimeter that defines a cavity () and a plurality of leads () extending inwardly from the perimeter and a first thickness. A second leadframe portion () is attached to the first leadframe portion (). The second leadframe portion () has a die paddle () received within the cavity () of the first leadframe portion (). The second leadframe portion () has a second thickness that is greater than a thickness of the first leadframe portion (). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.


Find Patent Forward Citations

Loading…