The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Feb. 27, 2002
BO Soon Chang, Cupertino, CA (US);
Bo Soon Chang, Cupertino, CA (US);
Cypress Semiconductor Corp., San Jose, CA (US);
Abstract
A method and system for a reject management protocol within a back-end IC manufacturing process. In one method embodiment, the present invention implements a tracking process for a die-strip. The present invention also maintains an electronic die-strip map database, and utilizes the tracking process to update the electronic die-strip map database as the die-strip moves in an in-line fashion from one sub-station to another within the manufacturing process. Information used to update the database can originate from one or more automated visual camera systems used for quality assurance. In so doing, the present invention categorizes the die on the die-strip based on information maintained by the electronic die-strip map database. This information can be used for die sorting and for die rejection. In one embodiment, an identifying code is placed on each die strip that can automatically identify the die-strip using the automated camera systems.