The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Feb. 02, 2005
Applicants:
Hui-chang Chen, Kaohsiung, TW;
Chun-yu Lee, Sinying, TW;
Inventors:
Hui-Chang Chen, Kaohsiung, TW;
Chun-Yu Lee, Sinying, TW;
Assignee:
AU Optronics Corp., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); B23K 1/19 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bonding configuration structure for facilitating electrical testing in a bonding process and a testing method are provided. The bonding configuration includes a bonded component, a bonding component, a bond portion and a leading component. The bonding component is disposed on the bonded component. The bonding component has a first end and a second end. The first end is coupled to the bond portion. The second end is disposed on the bonded component to form the first testing portion.