The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Mar. 20, 2003
Nai-shung Chang, Hsin-Tien, TW;
Nai-Shung Chang, Hsin-Tien, TW;
VIA Technologies Inc., Hsin-Tien, TW;
Abstract
A wire bonding BGA package. On a conductive metal layer of a substrate used for carrying a die, a power ring for providing an operating voltage to a core circuit of the die is disposed in the inner side of a power ring for providing an operating voltage to an input/output circuit of the die. When the die is packaged by flip chip packaging instead of wire bonding packaging, the power ballout assignment of the BGA package is unchanged and is suitable for matching with an original circuit board used for the flip chip BGA package. In addition, the present invention provides a flip chip BGA package. When the die is packaged by wire bonding packaging instead of flip chip packaging, the power ballout assignment of the BGA package is unchanged and is suitable for matching with an original circuit board used for the wire bonding BGA package.