The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2006

Filed:

Apr. 01, 2004
Applicants:

Timothy Brooks Bambridge, Pittstown, NJ (US);

Jeffery J. Gilbert, Schwenksville, PA (US);

Juan Alejandro Herbsommer, Lehigh County, PA (US);

Jeffrey Michael Klemovage, Whitehall, PA (US);

George John Libricz, Jr., Bethlehem, PA (US);

Inventors:

Timothy Brooks Bambridge, Pittstown, NJ (US);

Jeffery J. Gilbert, Schwenksville, PA (US);

Juan Alejandro Herbsommer, Lehigh County, PA (US);

Jeffrey Michael Klemovage, Whitehall, PA (US);

George John Libricz, Jr., Bethlehem, PA (US);

Assignee:

Agere Systems Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.


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