The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Sep. 25, 2003
Dave S. Mahadevan, Mesa, AZ (US);
Michael E. Chapman, Gilbert, AZ (US);
Arvind S. Salian, Chandler, AZ (US);
Dave S. Mahadevan, Mesa, AZ (US);
Michael E. Chapman, Gilbert, AZ (US);
Arvind S. Salian, Chandler, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer () over a mold encapsulant (). The conductive layer () may be electrically coupled using a wire to the leadframe () of the semiconductor package (). The electrical coupling can be performed by wire bonding two device portions () of a leadframe () together and then cutting the wire bond () by forming a groove () in the overlying mold encapsulant () to form two wires (). The conductive layer () is then electrically coupled to each of the two wires (). In another embodiment, a looped wire bond () is formed on top of a semiconductor die (). After mold encapsulation, portions of the mold encapsulant () are removed to expose portions of the looped wire bond (). The conductive layer () is then formed over the mold encapsulant () and the exposed portion of the looped wire bond () so that the conductive layer () is electrically coupled to the looped wire bond ().