The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Jan. 14, 2004
Takashi Hashimoto, Chino, JP;
Atsushi Takakuwa, Shiojiri, JP;
Tomoyuki Kamakura, Matsumoto, JP;
Sumio Utsunomiya, Suwa, JP;
Takashi Hashimoto, Chino, JP;
Atsushi Takakuwa, Shiojiri, JP;
Tomoyuki Kamakura, Matsumoto, JP;
Sumio Utsunomiya, Suwa, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A device manufacturing method, including: a first process for providing the plural elements on the original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer; a second process for adhering the surface where the terminal sections of the elements to be transferred on the original substrate are exposed, via conductive adhesive, to a surface of the final substrate on a side where conductive sections for conducting with the terminal sections of the elements are provided; a third process for producing exfoliation in the separation layer between the original substrate and the final substrate; and a fourth process for separating the original substrate from which the transfer of elements has been completed, from the final substrate.