The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Jan. 21, 2002
Christophe Prior, Le Versoud, FR;
Christophe Prior, Le Versoud, FR;
STMicroelectronics S.A., Montrouge, FR;
Abstract
Method of fabricating a semiconductor package and semiconductor package containing an integrated circuit chip having, on one front face, electrical connection regions, in which a first multilayer plate () comprising an assembly face () is furnished with an adhesive layer () and which has through-holes (); and a second plate () has a recess () made in one assembly face () fastened to the assembly face of the first plate via the said adhesive layer; the said chip () being placed in the said recess in a position such that its front face is fastened to the assembly face of the first plate via the said adhesive layer and that its electrical connection regions are located facing the through-holes of this first plate, and the bottom of the recess of the said second plate bearing against the rear face of the chip opposite the front face.