The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
May. 15, 2003
Applicants:
Yuichi Akanabe, Kunitachi, JP;
Tomohide Mizukoshi, Hino, JP;
Inventors:
Yuichi Akanabe, Kunitachi, JP;
Tomohide Mizukoshi, Hino, JP;
Assignee:
Konica Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of producing a die for forming an optical element including; a positioning step to fix temporarily under the state wherein a plurality of members at least one of which has a die transfer surface are positioned with their connection surfaces being put to face each other, and an electroforming connection step to connect both members by forming an electroforming mold on a circumference of the connection surface under the state where the plural members are positioned.