The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Jan. 24, 2003
Shuichi Ichikawa, Handa, JP;
Takashi Harada, Nagoya, JP;
Aiko Otsuka, Okazaki, JP;
Yukihisa Wada, Nisshin, JP;
Yoshinori Yamamoto, Nishikamo-gun, JP;
Shuichi Ichikawa, Handa, JP;
Takashi Harada, Nagoya, JP;
Aiko Otsuka, Okazaki, JP;
Yukihisa Wada, Nisshin, JP;
Yoshinori Yamamoto, Nishikamo-gun, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A honeycomb structurehas a large number of through-holesdivided by partition wallsand extending in the axial direction, characterized in that the honeycomb structure contains a Si phase having a lattice constant controlled at 0.54302 to 0.54311 nm at room temperature. A process for producing the honeycomb structure, includes a firing step of firing a precursor of honeycomb structure, wherein the precursor contains a Si phase and the firing step is conducted using a furnace material free from any boron-containing compound. A process for producing the honeycomb structure, includes a firing step of firing a precursor of honeycomb structure, wherein a reduction percentage of Si content in Si phase after firing step relative to Si content in Si phase before firing step is suppressed at 10% by mass or less. Having an improved thermal conductivity, the honeycomb structure is superior in thermal shock resistance.