The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Jul. 14, 2003
Sung-choul Lee, Gyeonggi-do, KR;
Sung-Choul Lee, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A polishing head of a wafer polishing apparatus includes a body, a center supporter installed in a center of the body, a perforated plate including an upper plate and a lower plate that is disposed below the center supporter and has a plurality of thru-holes, a membrane covering the perforated plate, and a moving member for moving the lower plate up and down. By moving the lower plate up and down, the polishing head forcibly recovers an elasticity of the membrane (especially at an edge portion of the membrane).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile