The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7028392 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 18, 2006

Filed:

Mar. 01, 2000
Applicant:

Günter Schiebel, München, DE;

Inventor:

Günter Schiebel, München, DE;

Assignee:

Siemens Dematic AG, Nuremberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A freely positionable placement head () removes presented flip chips () from a wafer (), the connection side of said chips being directed upward. The placement head has a turning device (), in which, by the time they are placed onto a substrate () to be provided with placed components, the flip chips are turned in such a way that they can be placed with their connection side onto the substrate. This makes it possible to dispense with a complex turning device assigned to the wafer ().


Find Patent Forward Citations

Schiebel, Günter. (2006). Device for fitting a substrate with a flip chip (U.S. Patent No. 7028392). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7028392

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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