The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
Apr. 25, 2003
Applicants:
Ewald Guenther, Regenstauf, DE;
Hooi Bin Lim, Penang, MY;
Shahrol Izzanni Abdul Manaf, Penang, MY;
Stefan Eigenbrodt, Penang, MY;
Soong Lin Teng, Penang, MY;
Inventors:
Ewald Guenther, Regenstauf, DE;
Hooi Bin Lim, Penang, MY;
Shahrol Izzanni Abdul Manaf, Penang, MY;
Stefan Eigenbrodt, Penang, MY;
Soong Lin Teng, Penang, MY;
Assignee:
Osram Opto Semiconductors (Malaysia) Sdn. Bhd, Penang, MY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01); H01L 35/24 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A device having bond pads within a bond pad region, the bond pads comprising a conductive material that is stable when exposed to atmospheric constituents. The bond pads can be formed from conductive oxide materials such as indium tin oxide. A contact layer is provided to enhance the conductivity between the bond pads and the active component of the device.