The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
May. 07, 2003
Applicants:
Lakhi N. Goenka, Ann Arbor, MI (US);
Peter J. Sinkunas, Canton, MI (US);
Larry N. Schmidt, Glenside, PA (US);
Sherwin T. Moss, Philadelphia, PA (US);
Inventors:
Lakhi N. Goenka, Ann Arbor, MI (US);
Peter J. Sinkunas, Canton, MI (US);
Larry N. Schmidt, Glenside, PA (US);
Sherwin T. Moss, Philadelphia, PA (US);
Assignee:
Visteon Global Technologies, Inc., Dearborn, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27D 11/00 (2006.01); F27B 9/06 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder.