The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
Jan. 21, 2005
Applicants:
Klaus Goller, Dresden, DE;
Stefan Eckert, Dresden, DE;
Anja Oesinghaus, Dresden, DE;
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 3/08 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device () includes a semiconductor component integrated in a semiconductor substrate and a conductive pad () arranged on top of the semiconductor device (). The conductive pad is electrically connected with the semiconductor component. The pad is arranged for connecting the semiconductor device () externally. A dielectric material () is positioned between the conductive pad () and a buried conductive layer () of the semiconductor device. The dielectric material () comprises a stress blocking structure.