The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7026248 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 11, 2006

Filed:

Jan. 21, 2003
Applicants:

Shoichi Yamauchi, Obu, JP;

Nobuhiro Tsuji, Okazaki, JP;

Inventors:

Shoichi Yamauchi, Obu, JP;

Nobuhiro Tsuji, Okazaki, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method for manufacturing a semiconductor device of the present invention, a portion of a first epitaxial layer formed in a trench in a silicon substrate is removed by vapor phase etching using a halogenated compound or hydrogen. In this removing process, the portion of the first epitaxial layer is removed at a predetermined temperature higher than that during epitaxial growth of the first epitaxial layer and at a predetermined pressure higher than that during epitaxial growth of the first epitaxial layer. Therefore, stress that would otherwise be concentrated at a bottom portion of the trench is relaxed because rearrangement of the silicon atoms increases.


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Yamauchi, Shoichi. (2006). Method for manufacturing semiconductor device with semiconductor region inserted into trench (U.S. Patent No. 7026248). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7026248

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