The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
Feb. 11, 2004
Chien-hua Chen, Corvallis, OR (US);
Bradley C. John, Sheridan, OR (US);
Charlotte R. Lanig, Albany, OR (US);
Melissa A. Workman, Portland, OR (US);
Chien-Hua Chen, Corvallis, OR (US);
Bradley C. John, Sheridan, OR (US);
Charlotte R. Lanig, Albany, OR (US);
Melissa A. Workman, Portland, OR (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A method for packaging and singulating a wafer having a plurality of micro devices includes providing a multi-lid substrate having a trench having intersection portions and non-intersection portions formed on a first side of the multi-lid substrate. The multi-lid substrate is coupled to the wafer such that the intersection portions of the trench pattern extend adjacent to at least three micro devices. Portions of the multi-lid substrate between a second side of the multi-lid substrate and the trench pattern are removed while the multi-lid substrate is coupled to the wafer.