The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
Jan. 14, 2002
Florence Eschbach, Portolla Valley, CA (US);
Eric James Lee, San Jose, CA (US);
Peter Beverley Powell Phipps, Saratoga, CA (US);
Amanda Baer, Campbell, CA (US);
Edward Hin Pong Lee, San Jose, CA (US);
Francisco Martin, San Jose, CA (US);
Florence Eschbach, Portolla Valley, CA (US);
Eric James Lee, San Jose, CA (US);
Peter Beverley Powell Phipps, Saratoga, CA (US);
Amanda Baer, Campbell, CA (US);
Edward Hin Pong Lee, San Jose, CA (US);
Francisco Martin, San Jose, CA (US);
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
A method for simultaneously planarizing to relatively equal smoothness a thin film magnetic head hardbaked resist structure having relatively low surface energy and one or more additional thin film magnetic head structures containing other materials having comparatively higher surface energy, such as copper, hardbaked resist, alumina and NiFe. The method begins with preparation of a chemical mechanical polishing (CMP) slurry targeted at equaling the removal rate of the materials to be planarized. The CMP slurry includes a liquid vehicle, an abrasive, and a surfactant. The CMP slurry is applied to the surface of the structures to be planarized and the structures are simultaneously planarized using a CMP planarization technique.