The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Mar. 10, 2004
Kuniharu Umeno, Tochigi, JP;
Shigehisa Ueda, Tochigi, JP;
Kuniharu Umeno, Tochigi, JP;
Shigehisa Ueda, Tochigi, JP;
Sumitomo Bakelite Company, Tokyo, JP;
Abstract
An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition for encapsulating a semiconductor chip containing an epoxy resin (A), a phenol resin (B), an inorganic filler (C) and a curing accelerator (D) as main components, and further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and Compound (F) contains two hydroxyl groups combined with each of adjacent carbon atoms in an aromatic ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.