The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2006

Filed:

Mar. 25, 2003
Applicants:

Michinari Yamanaka, Osaka, JP;

Hiroshi Yuasa, Kyoto, JP;

Tetsuo Satake, Hyogo, JP;

Etsuyoshi Kobori, Kyoto, JP;

Takeshi Yamashita, Osaka, JP;

Susumu Matsumoto, Osaka, JP;

Inventors:

Michinari Yamanaka, Osaka, JP;

Hiroshi Yuasa, Kyoto, JP;

Tetsuo Satake, Hyogo, JP;

Etsuyoshi Kobori, Kyoto, JP;

Takeshi Yamashita, Osaka, JP;

Susumu Matsumoto, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

After a hole is formed in a low dielectric constant film on a substrate, a protective film is formed on the wall surface of the hole or an electron acceptor is caused to be adsorbed by or implanted in the low dielectric constant film exposed at the wall surface of the hole. Otherwise, resist residue is left on the wall surface of the hole. Then, a resist pattern having an opening corresponding to a wire formation region including a region formed with the hole is formed by using a chemically amplified resist.


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