The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Oct. 08, 2002
Johan Bosman, Eindhoven, NL;
Peter Wilhelmus Maria Van DE Water, Nijmegen, NL;
Roelf Anco Jacob Groenhuis, Nijmegen, NL;
Johan Bosman, Eindhoven, NL;
Peter Wilhelmus Maria Van De Water, Nijmegen, NL;
Roelf Anco Jacob Groenhuis, Nijmegen, NL;
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Abstract
The invention relates to a method of manufacturing an electronic component (), in particular a semiconductor component (), which is provided with electric connection regions (), wherein a mark (M), such as a type number, is provided on a surface thereof by means of laser radiation (). In a method according to the invention, the component () is attached with one () of its sides () to a foil () by means of an adhesive layer (), and the component is provided, on said side (), with the mark (M) through the foil () and the adhesive layer (). In this manner, a large number of components () can be readily provided with a mark (M) without undue handling, and the marking operation can be readily integrated in the complete manufacturing process of the components. Surprisingly it has been found that marking through a radiation-absorbing double layer () is very well feasible. The component () can be attached to the foil () without contact between the electric connection region () and the adhesive layer. Preferably, a large number of components () are manufactured simultaneously and within a single body () that is attached to the foil (). After the provision of the mark (M), the components () are separated from each other.