The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Dec. 16, 2003
Sandeep Shrikant Tonapi, Niskayuna, NY (US);
John Campbell, Clifton Park, NY (US);
Ryan Mills, Rexford, NY (US);
Ananth Prabhakumar, Schenectady, NY (US);
Slawomir Rubinsztajn, Niskayuna, NY (US);
Sandeep Shrikant Tonapi, Niskayuna, NY (US);
John Campbell, Clifton Park, NY (US);
Ryan Mills, Rexford, NY (US);
Ananth Prabhakumar, Schenectady, NY (US);
Slawomir Rubinsztajn, Niskayuna, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.