The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Jun. 19, 2003
John F. Casey, Colorado Springs, CO (US);
Lewis R. Dove, Monument, CO (US);
Ling Liu, Colorado Springs, CO (US);
James R. Drehle, Colorado Springs, CO (US);
R. Frederick Rau, Jr., Colorado Springs, CO (US);
Rosemary O. Johnson, Colorado Springs, CO (US);
John F. Casey, Colorado Springs, CO (US);
Lewis R. Dove, Monument, CO (US);
Ling Liu, Colorado Springs, CO (US);
James R. Drehle, Colorado Springs, CO (US);
R. Frederick Rau, Jr., Colorado Springs, CO (US);
Rosemary O. Johnson, Colorado Springs, CO (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
Disclosed is a method for forming a conductor on a dielectric. The method commences with the deposition of a conductive thickfilm on the dielectric, followed by a 'subsintering' of the conductive thickfilm. Either before or after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired. A brief chemical etch may be used after the final firing step if improved wire-bondability is required.