The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Dec. 06, 2002
Rainer Klaus Krause, Kostheim, DE;
Jan Marien, Selzen, DE;
Johannes Thomas Paul, Mainz, DE;
Gunther Wilhelm Sandmann, Mainz, DE;
Gerhard Anton Scherb, Mainz, DE;
Hubert Erwin Schuy, Oppenheim, DE;
Stefan Seifried, Nidderau, DE;
Rainer Klaus Krause, Kostheim, DE;
Jan Marien, Selzen, DE;
Johannes Thomas Paul, Mainz, DE;
Gunther Wilhelm Sandmann, Mainz, DE;
Gerhard Anton Scherb, Mainz, DE;
Hubert Erwin Schuy, Oppenheim, DE;
Stefan Seifried, Nidderau, DE;
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
Methods of making a magnetic recording device with an 'anchored' conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head element of the magnetic recording device. The conductive stud has a top stud portion and a bottom undercut portion formed over the conductive layer. In one illustrated embodiment, the bottom undercut portion has a width that is greater than the width of the top stud portion. Since an insulator is formed around the conductive stud and over its bottom undercut portion, a secure coupling between the conductive stud and the conductive layer is provided. Preferably, the conductive layer is made of copper (Cu), the conductive stud is made of gold (Au), and the insulator is alumina (AlO). A seed layer may be formed between the conductive stud and the conductive layer.